Flat Alumina Polishing Powder

The flat aluminum oxide polishing powder has an aluminum oxide purity of more than 99%. The crystal shape is hexagonal flat and plate-like. It is heat-resistant, acid- and alkali-resistant, and has high hardness. Unlike traditional abrasive spherical particles, the bottom surface of flat aluminum oxide is flat. When grinding, the particles fit the surface of the workpiece, producing a sliding grinding effect to prevent the sharp corners of the particles from scratching the surface of the workpiece. On the other hand, when grinding flat aluminum oxide, the grinding pressure is evenly distributed on the particle surface, the particles are not easy to break, and the wear resistance is improved, thereby improving the grinding efficiency and surface finish.

 

Platelet Calcined Alumina Powder, also known as tabulated aluminum oxide grinding powder. It is named after its particle crystal structure being in the shape of scales/flat plates. The crystal form of flake alumina is α- Al2O3 has high hardness and grinding performance. In the electronics industry, polishing and polishing require high surface precision. In order to ensure precise grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of the abrasive particles of flake/flat alumina is flat and smooth, and the diameter to thickness ratio of the particles can be adjusted by adjusting the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, greatly improving the yield of qualified chips. The production of platelet calcined alumina adopts a high-temperature calcined method to promote the lateral growth of crystals and form regular hexagonal powders with a tabulated structure. The suspension treated aluminum oxide grinding powder of platelet shape gets an uniform particle size distribution. That ensure a fine grinding surface.

 

Flat Alumina Polishing Powder Advantages

 

For semiconductor materials such as semiconductor silicon wafers, the application of flat alumina can reduce grinding time, greatly improve grinding efficiency, reduce the loss of the grinding machine, save labor and grinding costs, and improve the grinding pass rate. The quality is close to that of well-known foreign brands.
The efficiency of CRT glass shell grinding is improved by 3-5 times;
The qualified product rate is increased by 10-15%, and the qualified product rate of semiconductor silicon wafers reaches more than 99%;
The grinding consumption is reduced by 40-40% compared with ordinary alumina polishing powder;

 

Flat Alumina Polishing Powder Application

1) Electronics industry: grinding and polishing of semiconductor single crystal silicon wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).
2) Glass industry: grinding and processing of crystal, quartz glass, cathode ray tube glass shell screen, optical glass, liquid crystal display (LCD) glass substrate, and piezoelectric quartz crystal.
3) Coating industry: fillers for special coatings and plasma spraying.
4) Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high temperature resistant coatings, etc.

 

Abrasive polishing liquid

 

Compared with conventional nano-alumina, the flat and smooth sheet surface is not easy to scratch the object being polished, and the qualified product rate can be increased by 10% to 15%. Therefore, plate-shaped alumina has become the new favorite of the high-precision microelectronics industry, gem processing industry and metal ceramic industry.

Inorganic fillers

 

Plate alumina is an indispensable filler in industrial production. It is used in functional ceramics, plastics and rubber products to increase hardness and rigidity, and can adjust shrinkage and thermal expansion coefficients.

Functional coating

 

The excellent plate-like aluminum oxide has no agglomeration phenomenon and good adhesion. It is easy to combine with other functional micropowders to prepare various new functional coating materials with attractive prospects. The aluminum oxide coating used for capillaries can significantly improve its reversal of electroosmotic flow performance and the selectivity and stability of target analysis; the functional coating used for stealth aircraft can absorb radio waves to prevent being searched by radar.

Flat Alumina Polishing Powder Characteristics

 

1. The Platelet calcined alumina powder produced by Bingyang Abrasive can achieve the grinding effect of imported sheet-like aluminum oxide powder compared to imported products.

2. The crystal form is flat without edges and corners, and during grinding, the abrasive particles produce a flat sliding effect between the workpiece, making it less prone to scratches.

3. High hardness and strong grinding force. Flaky alumina has properties similar to corundum α- Al2O3 crystal phase, suitable for grinding and polishing of most materials.

4. Low magnetic content, high cleanliness, and high particle size consistency.

5. High melting point, high mechanical strength, and high grinding efficiency.

6. The particle size is controllable and can be obtained from 3 to 50 microns.

7. The flatness of the particles makes the flake alumina powder easy to disperse, making it suitable for making abrasives or grinding liquids.

8. It has corrosion resistance, strong chemical stability, and superior antioxidant performance, and will not react with liquid media in the grinding fluid.

9. Large specific surface area, surface activity and adhesion due to flat Alumina polishing power.

10. Platelet calcined alumina powder is easy to disperse, and the powder is not easy to aggregate on the surface of the wafer, causing accumulation and affecting the polishing smoothness.

 

The electron microscope image is as follows

 

                               PTWA03 Electron Microscope Image

PTWA15 Electron Microscope Image

 

Flat Alumina Polishing Powder Chemical Component

 

Al2O3 >=99.0%
SiO2 <0.2
Fe2O3 <0.1
Na2O <1

 

Flat Alumina Polishing Powder Physical properties

 

Chemical Component

α-Al2O3

Colour White
Specific Density 3.9g/cm3
Mohs Hardness 9.0

 

Flat Alumina Polishing Powder Production specifications

 

Type D3(μm) D50(μm) D94(μm)
PTWA40 39-44.6 27.7-31.7 18-20
PTWA35 35.4-39.8 23.8-27.2 15-17
PTWA30 28.1-32.3 19.2-22.3 13.4-15.6
PTWA25 24.4-28.2 16.1-18.7 9.6-11.2
PTWA20 20.9-24.1 13.1-15.3 8.2-9.8
PTWA15 14.8-17.2 9.4-11 5.8-6.8
PTWA12 11.8-13.8 7.6-8.8 4.5-5.3
PTWA09 8.9-10.5 5.9-6.9 3.3-3.9
PTWA05 6.6-7.8 4.3-5.1 2.55-3.05
PTWA03 4.8-5.6 2.8-3.4 1.5-2.1

Packaging: 10kg/plastic bag, 20kg/box

 

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