2024 National Precision Grinding and Polishing Materials and Processing Technology Development Forum
Grinding and polishing is to reduce the roughness of the workpiece surface through mechanical, chemical or electrochemical methods to obtain a bright and smooth surface. It is an important means to improve product quality and performance. With the steady growth of the economy and the in-depth development of industrialization, the downstream demand for the grinding and polishing industry continues to increase, especially in the fields of automobiles, machinery, electronics, optics, and medical care. The requirements for the quality and efficiency of grinding and polishing will continue to increase, thereby promoting the development of the precision grinding and polishing industry. For example, for the processing of single crystal materials, flatness, thickness, and crystal orientation accuracy are also required; for the processing of electronic materials, in addition to high shape accuracy, it is also necessary to achieve a physical or crystallographic damage-free ideal mirror. At the same time, the precision grinding and polishing industry will also face more intense market competition and more stringent environmental protection requirements, which will prompt the industry to carry out technological innovation and product upgrades to improve the accuracy, efficiency, and energy-saving and environmental protection performance of grinding and polishing.
At present, new materials and new processes are constantly being applied, especially in the field of abrasive materials and abrasive tools. For example, abrasive materials and abrasive tools made of superhard materials, ceramic materials, diamond materials, etc. have the advantages of wear resistance, high temperature resistance, corrosion resistance, etc., and can adapt to different grinding and polishing conditions and requirements; new grinding and polishing processes such as laser, electron beam, ion beam, etc. have the advantages of high precision, high efficiency, low pollution, etc., and can achieve micron-level or even nano-level grinding and polishing. CMP polishing, abrasive flow polishing, magnetic fluid polishing, plasma-assisted polishing, etc., need further exploration for the optimization and upgrading of grinding and polishing materials and processing technologies.
On August 25-26, 2024, Powder Circle will hold the "2024 National Precision Grinding and Polishing Materials and Processing Technology Development Forum (Second)" in Wuxi, Jiangsu. At that time, it will gather R&D leaders of upstream and downstream units, technical experts from scientific research institutions and investment institutions in related industries to discuss the development opportunities and future directions in the field of precision grinding and polishing.